Free company profile — no paywall, no login

Bond Building LP

Washington, USA

Bond Building LP, Washington, USA · LEI: 549300AHLQ2C9DDQ0071 · Juridisk form: LP · Status: active. Free company profile — no paywall, no login

Companies at this address & nearby

Which companies share the address, street or postal code of Bond Building LP? Registered office clusters often reveal corporate networks, shell structures and shared back offices — sorted by share capital.

Same postal code (144)

20005 Washington

2030 companies are registered in Washington in total.

FAQ — Bond Building LP

What is the LEI of Bond Building LP?
Legal Entity Identifier (LEI) for Bond Building LP er 549300AHLQ2C9DDQ0071.
Hvor er Bond Building LP registreret?
Bond Building LP has its registered address in Washington, USA.
Is the register extract of Bond Building LP free of charge?
Ja. Eulerpool leverer alle virksomhedsregisterdata - inklusive den komplette registrering af Bond Building LP - helt gratis uden login påkrævet.

Officiel registreringsjournal

Det komplette officielle registeruddrag — hvert felt fra LEI/virksomhedsregistret, gratis, ingen login påkrævet.

Officiel registreringsjournal — Bond Building LP
legal_nameBond Building LP
legal_cityWashington
legal_jurisdictionUS
lei549300AHLQ2C9DDQ0071
legal_first_address_line1090 Vermont Avenue, NW
legal_postal_code20005
headquarters_cityWashington
headquarters_postal_code20005
registration_statusactive
entity_legal_form_codeLP
registry_id4594900889763840
sourceregistry